The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Feb. 02, 2022
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Takuya Matsumoto, San Jose, CA (US);

Barry C. Stipe, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/042 (2006.01); G11B 5/48 (2006.01); G11B 13/08 (2006.01); H01S 5/02 (2006.01); H01S 5/02326 (2021.01); H01S 5/0233 (2021.01); H01S 5/0237 (2021.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01S 5/04256 (2019.08); G11B 5/4826 (2013.01); G11B 5/4866 (2013.01); G11B 13/08 (2013.01); H01S 5/0201 (2013.01); H01S 5/02326 (2021.01); H01S 5/0233 (2021.01); H01S 5/0237 (2021.01); H01S 5/04257 (2019.08); H01S 5/18394 (2013.01); H01S 5/423 (2013.01); G11B 2005/0021 (2013.01); H01S 5/183 (2013.01);
Abstract

Embodiments of the present disclosure generally relate to a vertical cavity surface emitting laser (VCSEL), a head gimbal assembly for mounting a VCSEL, devices incorporating such articles, and to a process for forming a VCSEL. In an embodiment, a process for forming a VCSEL device is provided. The process includes forming a trench in a substrate, forming two laser diode electrodes in the trench, and after forming the two laser diode electrodes, cutting the substrate along the trench to form a VCSEL, the VCSEL comprising a chip for mounting on a slider, the chip having six surfaces, wherein a first surface of the chip is for facing the slider, a second surface of the chip is opposite the first surface, the two laser diode electrodes being positioned in any combination on one or more of a third surface, a fourth surface, a fifth surface, or a sixth surface.


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Matsumoto, Takuya. (2026). Vertical cavity surface emitting laser, head gimbal assembly, and fabrication process (U.S. Patent No. 12706439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12706439

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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