The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Jul. 19, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Jugo Mitomo, Kumamoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/0233 (2021.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/0233 (2021.01); H01S 5/18305 (2013.01); H01S 5/423 (2013.01);
Abstract

Provided are a surface emitting laser device and an electronic device that includes the surface emitting laser device. The is a surface emitting laser device includes an element unit including an element arrangement area in which a plurality of surface emitting laser elements is arranged, and an adjacent area adjacent to the element arrangement area. The surface emitting laser device further includes a driver unit including a driver IC, a plurality of first bumps that individually joins each of the plurality of surface emitting laser elements and the driver unit; and a plurality of second bumps that joins the adjacent area and the driver unit. Each of the plurality of first bumps and each of the plurality of second bumps include a conductive material that becomes difficult to be crushed by pressurization. The plurality of second bumps is arranged at a higher density than the plurality of first bumps.


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