The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Dec. 22, 2022
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Seungmin Woo, Seoul, KR;

Yusuhk Suh, Seoul, KR;

Dongik Lee, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 15/24 (2006.01); H01Q 1/22 (2006.01); H01Q 1/52 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01);
U.S. Cl.
CPC ...
H01Q 15/24 (2013.01); H01Q 1/22 (2013.01); H01Q 1/526 (2013.01); H01Q 9/0414 (2013.01); H01Q 21/06 (2013.01);
Abstract

This antenna module may comprise a multi-layer substrate composed of a plurality of dielectrics, and conductive patterns. The multi-layer substrate includes: a first layer made of a flexible first material; second layers, which are formed on one side surface of the first layer and are composed of a plurality of layers made of a stiff second material; and third layers, which are formed on the other side surface of the first layer and are composed of a plurality of layers made of the stiff second material. The conductive patterns includes: a first conductive pattern formed on the one side surface in first and second regions of the one side surface of the first layer; a second conductive pattern formed on a lower third layer; and a third conductive pattern formed on a lower fourth layer. The second and third conductive patterns can be connected through via holes.


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