The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Aug. 01, 2025
Applicant:

Tpk Advanced Solutions Inc., Xiamen, CN;

Inventors:

Cai Jin Ye, Xiamen City, CN;

Tsai Kuei Wei, Hsinchu County, TW;

Wei Yi Lin, Taoyuan City, TW;

Chen Hsin Chang, Taoyuan City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/0354 (2013.01); G06F 3/044 (2006.01); G06F 3/046 (2006.01);
U.S. Cl.
CPC ...
G06F 3/03547 (2013.01); G06F 3/0445 (2019.05); G06F 3/0448 (2019.05); G06F 3/046 (2013.01);
Abstract

A touchpad device includes a first assembly, a second assembly, and a plurality of elastic members. The first assembly includes a cover plate, an adhesive layer, and a circuit board. The cover plate has a bonding area and a non-bonding area. The adhesive layer is disposed under the cover plate and has a plurality of closed slots corresponding to the non-bonding area. The adhesive layer has a thickness of about 50 μm to about 500 μm. The circuit board is disposed under the adhesive layer and includes a touch sensing member and a coil layer. The second assembly includes a supporting member and a magnet set disposed on the supporting member. The elastic members are disposed between the first assembly and the second assembly and correspond to the closed slots in an arrangement direction of the cover plate and the adhesive layer.


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