The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Dec. 03, 2021
Resonac Corporation, Tokyo, JP;
Shogo Sobue, Tokyo, JP;
Yuki Nakamura, Tokyo, JP;
Saeko Ogawa, Tokyo, JP;
Daisuke Ikeda, Tokyo, JP;
Keisuke Okawara, Tokyo, JP;
Abstract
A method for producing a semiconductor device, including forming a temporary fixing laminated body including a carrier, and a sealing structure body provided on a main surface of the carrier, and removing the carrier from the temporary fixing laminated body. The temporary fixing laminated body is formed by a method including adhering the curable resin film and the carrier. The carrier is removed from the temporary fixing laminated body by separating a protective layer that is the curable resin film that is cured from the carrier. The curable resin film exhibits a transmittance of 20% or less with respect to light at a wavelength of 355 nm when cured.