The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 27, 2023
Analog Devices International Unlimited Company, Limerick, IE;
Santosh Kudtarkar, Ayer, MA (US);
Islam A. Eshrah, Cairo, EG;
Analog Devices International Unlimited Company, Limerick, IE;
Abstract
A radio frequency stacked die assembly can include a laminate substrate with a layer of conductive traces between a first plurality of laminate layers. The stacked die assembly can include surface mount antenna packages mounted to an exterior surface of the substrate, each antenna package including a radio frequency patch antenna embedded within a second plurality of laminate layers. The stacked die assembly further includes one or more surface mount passive devices and a flip chip semiconductor die mounted to opposite sides of the substrate. A plurality of solder balls are provided for mounting the substrate to a printed circuit board. The flip chip die, radio frequency antennas, passive devices, and solder balls are connected by the layer of conductive traces. Separating the patch antenna(s) from the substrate and into an antenna package simplifies construction and testing of the stacked die assembly, and can yield improved antenna performance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile