The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jul. 24, 2023
Mitsubishi Electric Corporation, Tokyo, JP;
Katsushi Nakada, Tokyo, JP;
Yoshitaka Miyaji, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Provided is a semiconductor power module in which an electric field at corners of electrodes and around the corners is reduced while size reduction and voltage increase are achieved. The semiconductor power module includes a plurality of electrodes having different potentials and laid over each other with an interval therebetween. As seen in a direction in which the plurality of electrodes are laid over each other, each of the plurality of electrodes has three or more corners, at least a part of the corner of one of adjacent two of the electrodes is provided on an outer side relative to another of the adjacent two electrodes, and at least a part of the corner of the other electrode is provided on an outer side relative to the one electrode.