The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Dec. 14, 2022
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Hongmei Liao, San Diego, CA (US);
Xiaohua Kong, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H02H 9/04 (2006.01); H10D 1/60 (2025.01); H10W 20/40 (2026.01); H10W 40/00 (2026.01); H10W 40/22 (2026.01); H10W 44/00 (2026.01); H10W 72/00 (2026.01); H10W 72/20 (2026.01); H10W 72/29 (2026.01); H10W 72/30 (2026.01); H10W 72/90 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H10W 99/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/497 (2026.01); H02H 9/046 (2013.01); H10W 44/501 (2026.01); H10W 44/601 (2026.01); H10W 72/234 (2026.01); H10W 72/241 (2026.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01); H10W 72/29 (2026.01); H10W 90/724 (2026.01);
Abstract
An integrated circuit (IC) including an IC bump; and a Tcoil situated directly below the IC bump, wherein the Tcoil is electrically coupled to the IC bump by way of a metallized via hole.