The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Sep. 18, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Tae Hee Lee, Yongin-si, KR;

Kyung Ho Kim, Yongin-si, KR;

Young Seok Seo, Yongin-si, KR;

Joo Woan Cho, Yongin-si, KR;

Byeong Hwa Choi, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); H10P 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/0428 (2026.01); H10P 72/0604 (2026.01); H10W 90/00 (2026.01); B29C 65/00 (2013.01);
Abstract

An apparatus for fabricating a display panel, the apparatus including: a loading module configured to accommodate a large-area fabricating substrate, the loading module being configured to adjust an inclination of the large-area fabricating substrate from a rear surface of the large-area fabricating substrate and to press the large-area fabricating substrate; and an element transfer module configured to transfer a plurality of light emitting elements or an integrated circuit onto the large-area fabricating substrate and configured to bond and press a wafer on which the plurality of light emitting elements or the at least one integrated circuit is located onto the large-area fabricating substrate.


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