The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Feb. 25, 2021
Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Weiyun Huang, Beijing, CN;

Yao Huang, Beijing, CN;

Chao Zeng, Beijing, CN;

Yue Long, Beijing, CN;

Tianyi Cheng, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10K 59/124 (2023.01); H10K 59/122 (2023.01); H10K 59/12 (2023.01); H10K 59/80 (2023.01);
U.S. Cl.
CPC ...
H10K 59/124 (2023.02); H10K 59/122 (2023.02); H10K 59/1201 (2023.02); H10K 59/8731 (2023.02);
Abstract

The present disclosure provides an array substrate, a preparation method thereof, and a display device. The array substrate has an opening area and a hole border area. A method of preparation of the array substrate includes: forming a source-drain metal layer on a side of the base substrate, wherein the source-drain metal layer is formed with a first isolation pillar surrounding the opening area in the hole border area, and the first isolation pillar includes a first metal layer and a second metal layer located on a side of the first metal layer away from the base substrate; forming a planarization layer covering at least a lateral surface of each first metal layer; forming a pixel electrode layer; forming a protective layer covering the pixel electrode layer, the protective layer exposing the hole border area; removing a part of the planarization layer located in the hole border area; partially etching the first metal layer from the lateral surface to form a third metal layer; removing the protective layer; forming an organic light emitting layer and a common electrode layer in sequence. The preparation method of the array substrate can improve the yield of the array substrate.


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