The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Aug. 30, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ikjun Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a semiconductor chip structure and a transparent substrate. The semiconductor chip structure includes first and second semiconductor chips. The first semiconductor chip includes a semiconductor substrate including first and second surfaces, a wiring layer, and a through electrode. The first semiconductor chip has a step structure on an edge of the semiconductor chip structure and connected to the second surface. The step structure includes first to fourth steps. The first step includes a first bottom surface and a first lateral surface. The second step includes a second bottom surface and a second lateral surface. The third step includes a third bottom surface and a third lateral surface. The through electrode extends from the second bottom surface toward the wiring layer.