The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Sep. 26, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Seung Min Song, Halfmoon, NY (US);
Panjae Park, Clifton Park, NY (US);
Kang-Ill Seo, Springfield, VA (US);
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/23 (2025.01); H10D 64/01 (2025.01);
U.S. Cl.
CPC ...
H10D 64/256 (2025.01); H10D 64/01 (2025.01);
Abstract
Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1portion which is not vertically overlapped by the circuit element.
Song, Seung. (2026). Semiconductor device including extended backside contact structure (U.S. Patent No. 12701768). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12701768
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile