The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 04, 2022
Hitachi Astemo, Ltd., Hitachinaka, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
In an electric circuit body, at least one of the cooling members fixed to both surfaces of a first semiconductor module and a second semiconductor module includes a first heat dissipation region that abuts on the first semiconductor module through a heat conduction member, a second heat dissipation region that abuts on the second semiconductor module through the heat conduction member, and a low rigidity portion formed between the first heat dissipation region and the second heat dissipation region to have lower rigidity than the first heat dissipation region and the second heat dissipation region; and the fixing member fixes the cooling member to both surfaces of the first semiconductor module and the second semiconductor module in the low rigidity portion of the cooling member.