The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Dec. 19, 2023
Applicant:

Transportation Ip Holdings, Llc, Norwalk, CT (US);

Inventors:

Brett Heher, Pittsburgh, PA (US);

John D. Walker, Erie, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 80/00 (2015.01); H05K 7/20 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); B33Y 80/00 (2014.12); H05K 7/20127 (2013.01); B33Y 10/00 (2014.12);
Abstract

A thermal management system may include a solid state heat pump thermally coupled with a component and a first thermal management assembly thermally coupled with the heat pump. The first thermal management assembly may conduct the thermal energy between the component and an external environment via the heat pump. The system may include a second thermal management assembly thermally coupled with the component to conduct the thermal energy between the component and the external environment. The first thermal management assembly can conduct a first portion of the thermal energy between the component and the external environment via the solid state heat pump. The second thermal management assembly may conduct a second portion of the thermal energy between the component and the external environment. These portions of thermal energy can create convection movement of a working fluid between the thermal management assemblies.


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