The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Sep. 22, 2022
Applicant:
Lg Energy Solution, Ltd., Seoul, KR;
Inventors:
Assignee:
LG Energy Solution, Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01M 10/42 (2006.01); H01M 50/284 (2021.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01M 10/425 (2013.01); H01M 50/284 (2021.01); H01M 2010/4271 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/2081 (2013.01);
Abstract
A printed circuit board includes an inner layer; a first insulating layer formed on an upper part of the inner layer; a first copper foil layer formed on an upper part of the first insulating layer; and a solder resist layer formed on an upper part of the first copper foil layer. When welding a metal tab onto the solder resist layer, a welding portion that couples the metal tab and the first copper foil layer is formed, and a gap is formed at a portion adjacent to the welding portion.