The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Mar. 19, 2025
Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Shouyu Hong, Shanghai, CN;

Ganyu Zhou, Shanghai, CN;

Zhiheng Fu, Shanghai, CN;

Yan Tong, Shanghai, CN;

Qingdong Chen, Shanghai, CN;

Xiaoni Xin, Shanghai, CN;

Jinping Zhou, Shanghai, CN;

Pengkai Ji, Shanghai, CN;

Yiqing Ye, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 27/32 (2006.01); H01F 41/02 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/24 (2013.01); H01F 27/324 (2013.01); H01F 41/0206 (2013.01); H01F 41/041 (2013.01); H01F 41/125 (2013.01);
Abstract

The present disclosure provides a manufacturing method of a magnetic element, comprising: forming an insulation layer on an outer side of at least one section of a magnetic column of a magnetic core; forming a first groove on the insulation layer; forming a surface copper and a first hole copper respectively on a surface of the insulation layer and an inner surface of the first groove; dividing the surface copper into a first surface copper close to the magnetic core and a second surface copper away from the magnetic core, and dividing the first hole copper into a first sidewall copper close to the magnetic core and a second sidewall copper away from the magnetic core; drilling a hole on the second insulation layer, and forming a first conductor and a third surface copper respectively in the hole and on the second insulation layer.


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