The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Mar. 09, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Jun Kato, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B05C 5/02 (2006.01); B29C 59/02 (2006.01); B29L 31/34 (2006.01); H10P 95/00 (2026.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B05C 5/0291 (2013.01); B29C 59/022 (2013.01); B29C 59/026 (2013.01); B29L 2031/3406 (2013.01); H10P 95/08 (2026.01);
Abstract

The present invention provides a film forming method of forming a film on a substrate, wherein the substrate includes a region including a first concave portion and a second concave portion, the first concave portion has a width larger than that of the second concave portion, and the film forming method includes: selectively supplying a first material into the first concave portion and molding the first material; and supplying a second material onto the region and molding the second material, such that the second concave portion is filled with the second material and a planarization film of the second material is formed over all of the region.


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