The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Dec. 01, 2023
Applicant:

Schneider Electric Usa, Inc., Andover, MA (US);

Inventors:

Adrian Abdala Rendon Hernandez, Tiffin, IA (US);

Juan Ignacio Melecio Ramirez, North Liberty, IA (US);

Collin Richard Fischels, Independence, IA (US);

Assignee:

SCHNEIDER ELECTRIC USA, INC., Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 19/25 (2006.01); G01R 15/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); G01R 31/52 (2020.01);
U.S. Cl.
CPC ...
G01R 15/181 (2013.01); G01R 19/2513 (2013.01); H05K 1/0216 (2013.01); H05K 1/116 (2013.01); G01R 31/52 (2020.01); H05K 2201/09227 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A system and method are provided for energy monitoring. The system and method include a trace current sensor formed on a first printed circuit board (PCB) substrate around at an opening of the first PCB substrate. The opening is configured to receive a portion of an electrical conductor to be monitored by the sensor. The system and method also include a signal conditioner for conditioning an output signal from the sensor. The output signal corresponds to a measurement of current on the conductor. The system and method can further include a processor(s) for measuring energy usage of load(s) connected to the conductor based on the current measurement. The signal conditioner and/or the processor(s) are either on the first PCB substrate or on a separate second PCB substrate which is connected to the first PCB substrate across a flexible connector.


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