The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Oct. 18, 2022
Applicant:

Signify Holding B.v., Eindhoven, NL;

Inventors:

Feng Tian, Shanghai, CN;

Feng Pan, Shanghai, CN;

Assignee:

SIGNIFY HOLDING B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 17/02 (2006.01); F21S 8/08 (2006.01); F21V 23/00 (2015.01); F21V 29/508 (2015.01); F21V 29/70 (2015.01);
U.S. Cl.
CPC ...
F21V 29/508 (2015.01); F21V 17/02 (2013.01); F21V 29/70 (2015.01); F21S 8/085 (2013.01); F21V 23/008 (2013.01);
Abstract

An electronic assembly comprises a housing having abase and a cover and electronic component mounted in the housing on a carrier. The carrier is pivotable about a first edge within the housing. An adjustment handle moves the carrier at a second, opposite, edge thereby to bring the electronic component into thermal contact with an internal surface of the cover after the cover is closed (or during closing of the cover), for dissipating heat from the electronic component.


Find Patent Forward Citations

Tian, Feng. (2026). Electronic assembly (U.S. Patent No. 12698893). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12698893

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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