The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Oct. 18, 2023
Applicant:

Advanced Micro-fabrication Equipment Inc. China, Shanghai, CN;

Inventors:

Heng Tao, Shanghai, CN;

Yunling Pang, Shanghai, CN;

Hai Cong, Shanghai, CN;

Yong Jiang, Shanghai, CN;

Gerald Zhe Yao Yin, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/16 (2006.01); C23C 16/455 (2006.01); C23C 16/48 (2006.01); C30B 25/08 (2006.01); C30B 25/10 (2006.01);
U.S. Cl.
CPC ...
C30B 25/16 (2013.01); C23C 16/45557 (2013.01); C23C 16/482 (2013.01); C30B 25/08 (2013.01); C30B 25/10 (2013.01);
Abstract

Disclosed herein are a semiconductor processing chamber, semiconductor processing equipment and vapor epitaxy equipment, solving technical problems of process gas uniformity, infrared radiation transmittance and pressure-bearing capacity in the field of semiconductor processing. Mainly, an upper cover of a processing chamber is covered by a pressure-bearing shell and a confined space is formed, a pressure-regulating device is configured to regulate air pressure of the confined space and further regulate air pressure borne by upper and lower surfaces of the upper cover of the semiconductor processing chamber, the structural design of the upper cover is optimized, such that, in a semiconductor processing process, in order to realize processing with higher uniformity and higher quality on a surface of a substrate, the upper cover can be improved in a larger range to obtain a more optimized processing space.


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