The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jun. 01, 2023
Applicant:
Henkel Ag & Co., Kgaa, Duesseldorf, DE;
Inventor:
AI Takamori, Osaka, JP;
Assignee:
HENKEL AG & CO., KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 123/08 (2006.01); C09J 5/06 (2006.01); C09J 11/08 (2006.01); C09J 133/10 (2006.01);
U.S. Cl.
CPC ...
C09J 123/0807 (2013.01); C09J 11/08 (2013.01); C09J 133/10 (2013.01);
Abstract
Disclosed is a hot melt adhesive comprising: (A) a copolymer of ethylene with an olefin having 3 to 20 carbon atoms; (B) a copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond; and (C) a tackifying resin, wherein the (B) copolymer of ethylene with a carboxylic acid derivative having an ethylenic double bond comprises (B1) a copolymer of ethylene with a (meth)acrylic acid derivative, which copolymer (B1) has a melt flow rate of 1 to 38 g/10 min.
Takamori, AI. (2026). Hot melt adhesive (U.S. Patent No. 12698425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12698425
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile