The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Feb. 01, 2021
Jsp Corporation, Tokyo, JP;
Tatsuya Hayashi, Yokkaichi, JP;
JSP CORPORATION, Tokyo, JP;
Abstract
Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained under a predetermined condition; an amount of heat of fusion of the high-temperature peak is within 5 J/g or more and 50 J/g or less; and a coefficient of variation of the amount of heat of fusion of the high-temperature peak is 20% or less. The beads are produced by in-mold molding. A method for producing the beads includes: impregnating a polyamide-based resin; and releasing expandable polyamide-based resin beads from a sealed container, a temperature in the sealed container is raised at a rate of 0.3° C. or higher and 1.5° C. or lower per 10 minutes.