The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Oct. 10, 2023
National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);
Devin John Roach, Albuquerque, NM (US);
Andrew Rohskopf, San Jose, CA (US);
William Derek Reinholtz, Albuquerque, NM (US);
Adam Wade Cook, Albuquerque, NM (US);
Leah N. Appelhans, Tijeras, NM (US);
National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US);
Abstract
A machine learning (ML) approach enables real-time direct ink write (DIW) print-parameter optimization through in-situ monitoring of printed line geometry. The method can use an invertible neural network (INN) to solve both forward and inverse, or optimization, problems using a single network. By combining in-situ computer vision and INNs, DIW printing parameters can be autonomously optimized to print a target line width in a matter of seconds. Furthermore, defects that occur during printing can be rapidly identified and corrected autonomously. The method eliminates user-intensive, time-consuming, iterative parameter discovery approaches that currently limit accelerated implementation of DIW and other extrusion-based additive manufacturing processes.