The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Jul. 21, 2025
Applicant:

Enpulse Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Jungnam Lee, Chungcheongnam-do, KR;

Seungsik Yoon, Chungcheongnam-do, KR;

Jaechul Chang, Chungcheongnam-do, KR;

Jaejung Byun, Chungcheongnam-do, KR;

Yongsoo Choi, Chungcheongnam-do, KR;

Yujin Shin, Chungcheongnam-do, KR;

Jongwoo Kim, Chungcheongnam-do, KR;

Sunghyung Oh, Chungcheongnam-do, KR;

Assignee:

Enpulse Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/22 (2013.01); B24B 37/26 (2013.01);
Abstract

According to embodiments of the present invention, there are provided a recycled polishing pad and a process for preparing a recycled polishing pad. The recycled polishing pad comprises a cushion layer, an adhesive layer, and a reused polishing layer having a plurality of grooves on one side, and the compressibility of the reused polishing layer calculated by a specific equation is controlled within a predetermined range; thus, the polishing layer can be reused while excellent polishing rate and polishing uniformity are maintained.


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