The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2026

Filed:

Jan. 27, 2023
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

Andrew J. Ries, Lino Lakes, MN (US);

Mark E. Henschel, Phoenix, AZ (US);

James R. Wasson, Tempe, AZ (US);

Chunho Kim, Phoenix, AZ (US);

Walter E. Benecke, Scottsdale, AZ (US);

Kris A. Peterson, Edina, MN (US);

Jeff M. Wheeler, Gilbert, AZ (US);

Songhua Shi, Tempe, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01); A61N 1/372 (2006.01); A61N 1/375 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/37223 (2013.01);
Abstract

Various embodiments of a feedthrough assembly are disclosed. The assembly includes a header and a test fanout layer electrically connected to the header. A first major surface of the test fanout layer faces an inner surface of the header. The assembly further includes a test via extending between the first major surface and a second major surface of the test fanout layer, and a test pad disposed on the first major surface of the test fanout layer and electrically connected to the test via. At least a portion of the test pad is disposed between the outer surface of the header and a perimeter of the test fanout layer as viewed in a plane parallel to the first major surface of the test fanout layer such that the at least a portion of the test pad is exposed.


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