The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 18, 2023
Mitsubishi Electric Corporation, Tokyo, JP;
Mamoru Togami, Tokyo, JP;
Kosuke Yamaguchi, Tokyo, JP;
Shogo Shibata, Tokyo, JP;
Kazufumi Oki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
According to the present disclosure, a semiconductor apparatus comprises a plurality of integrated circuits, an IC frame on which the plurality of integrated circuits are mounted, and a sealing material. The IC frame comprises a first protrusion extending in a longitudinal direction of the IC frame, a second protrusion positioned on the opposite side to the first protrusion in the IC frame and extending in an opposite direction to the first protrusion, and a third protrusion extending in a direction perpendicular to the longitudinal direction of the IC frame and incorporated in the sealing material.