The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
May. 25, 2020
Rohm Co., Ltd., Kyoto, JP;
Kazunori Fuji, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
A semiconductor device includes an insulation layer, wires, a semiconductor element, and an encapsulation resin. The insulation layer includes a main surface and a back surface facing opposite in a thickness-wise direction and a side surface formed between the main surface and the back surface in the thickness-wise direction. The wires include an embedded portion embedded in the insulation layer and a redistribution portion formed of a metal film joined to the embedded portion and formed from the back surface to the side surface. The semiconductor element is mounted on the main surface and includes electrodes joined to at least part of the embedded portion of the wires. The encapsulation resin contacts the main surface and covers the semiconductor element.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile