The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Aug. 15, 2023
Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A method for manufacturing a system-in-package module includes providing a carrier plate; mounting a plurality of electronic components on the carrier plate, wherein the plurality of electronic components are electrically connected to the carrier plate; providing a plastic encapsulation film which comprises a resin and an inorganic filler; providing an electromagnetic shielding film; pressing the electromagnetic shielding film and the plastic encapsulation film into a composite structure; and pressing the composite structure onto the carrier plate, wherein the plastic encapsulation film is in contact with and covers a surface of the carrier plate and encapsulates the plurality of electronic components. A system-in-package module is also disclosed.