The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Mar. 02, 2022
Hitachi Astemo, Ltd., Hitachinaka, JP;
Junpei Kusukawa, Tokyo, JP;
Eiichi Ide, Tokyo, JP;
Takashi Hirao, Hitachinaka, JP;
Yujiro Kaneko, Hitachinaka, JP;
Hitachi Astemo, Ltd., Ibaraki, JP;
Abstract
A power semiconductor device includes a circuit body in which a conductor plate and a semiconductor element mounted on the conductor plate are sealed with a sealing resin, a cooler disposed opposite to at least one surface of the circuit body, and an insulating member disposed between the circuit body and the cooler. The insulating member includes an insulating sheet bonded to the cooler and a conductor layer bonded to a surface of the insulating sheet facing the circuit body. Electrically insulating heat-dissipation grease is filled between the circuit body and the cooler and covers the insulating sheet and the conductor layer. In some embodiments, an outer peripheral edge of the conductor layer is positioned outward of an outer peripheral edge of a surface of the conductor plate exposed from the sealing resin. In some embodiments, the conductor layer is embedded in the insulating sheet or an end part of the conductor layer is covered with an insulating resin having lower elasticity than the sealing resin.