The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Apr. 27, 2022
Aoi Electronics Co., Ltd., Takamatsu, JP;
AOI ELECTRONICS CO., LTD., Kagawa, JP;
Abstract
A semiconductor wafer has a first pad electrode and a plurality of second pad electrodes formed on an upper surface thereof. A first opening and a plurality of second openings are formed in an insulating film covering the first pad electrode and the plurality of second pad electrodes. The first pad electrode is electrically connected to a first redistribution wiring in the first opening, and the plurality of second pad electrodes are electrically connected to a second redistribution wiring in the plurality of second openings. The first redistribution wiring has a narrow region and a wide region, a first columnar electrode is formed on the wide region, and a second columnar electrode is formed on the first columnar electrode. A third redistribution wiring is formed on the second redistribution wiring, and a plurality of third columnar electrodes are formed on the third redistribution wiring.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile