The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Jan. 12, 2024
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Martin Caron, Québec, CA;

Raphael Beaupré-Laflamme, Quebec, CA;

Simon Savard, Quebec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 72/76 (2026.01);
U.S. Cl.
CPC ...
H10P 72/76 (2026.01);
Abstract

An apparatus for securing a semiconductor wafer portion (SWP) comprises: a first rotatable structure (RS) configured to perform a first rotation and a first counterrotation about a first axis; a second RS configured to perform a second rotation and a second counterrotation about a second axis; a first set of one or more adjustable adhesive regions (AARs) located on the first RS and in contact with the SWP, where each AAR in the first set of AARs is configured to increase its adhesion to the SWP during the first rotation and to decrease its adhesion during the first counterrotation; and a second set of one or more AARs located on the second RS and in contact with the SWP, where each AAR in the second set of AARs is configured to increase its adhesion to the SWP during the second rotation and decrease its adhesion during the second counterrotation.


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