The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Oct. 06, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mir Abdulla Al Galib, Sunnyvale, CA (US);

Sonam Dorje Sherpa, San Ramon, CA (US);

Kenji Takeshita, Sunnyvale, CA (US);

Alok Ranjan, San Ramon, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 50/00 (2026.01); H10P 76/40 (2026.01);
U.S. Cl.
CPC ...
H10P 50/73 (2026.01); H10P 76/405 (2026.01); H10P 76/4085 (2026.01);
Abstract

Methods of semiconductor processing may include forming plasma effluents. The plasma effluents may then contact a carbon-containing hardmask and an oxide cap. The plasma effluents can etch one or more features in the oxide cap through one or more apertures of the carbon-containing hardmask. Etching can create a tapered profile for one or more features in the oxide cap. The one or more features can be characterized by a critical dimension at the bottom of the one or more features. The critical dimension can be less than or about 80% of a width of the one or more apertures.


Find Patent Forward Citations

Abdulla Al Galib, Mir. (2026). Bow mitigation in high aspect ratio oxide and nitride etches (U.S. Patent No. 12696703). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12696703

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…