The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jun. 20, 2024
Applicants:
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
Inventors:
Assignees:
Inventec (Pudong) Technology Corporation, Shanghai, CN;
INVENTEC CORPORATION, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20772 (2013.01); H05K 1/0203 (2013.01); H05K 1/144 (2013.01); H05K 7/20272 (2013.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01);
Abstract
A liquid cooling device and a server are provided. The liquid cooling device includes at least two motherboards provided in a stack, and each motherboard being provided with at least two heat generating elements; and a plurality of liquid cooling plates attached to the plurality of heat generating elements in a one-to-one correspondence. Two liquid cooling plates corresponding to two heat generating elements on the same motherboard are connected in series form a liquid cooling loop, and a plurality of liquid cooling loops are connected in parallel.