The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Apr. 03, 2023
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Raphael Beaupré-Laflamme, Quebec, CA;

Simon Savard, Quebec, CA;

Jean-Sébastien Côté, Québec, CA;

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/303 (2026.01); B25J 9/16 (2006.01); H05K 13/04 (2006.01); B25J 13/08 (2006.01); B25J 17/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); B25J 9/1687 (2013.01); H05K 13/0409 (2018.08); B25J 13/088 (2013.01); B25J 17/0225 (2013.01); Y10T 29/49133 (2015.01);
Abstract

In one aspect, in general, a method for placing a chip for device manufacturing comprises: picking up the chip with a component placement tool comprises a tool surface; spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising beginning the spatially translating at a first spatial coordinate with respect to the direction, and ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction.


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