The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Oct. 29, 2021
Chongqing Boe Electronic Technology Co., Ltd., Chongqing, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Jie Zhang, Beijing, CN;
Guangchao He, Beijing, CN;
Qining Mao, Beijing, CN;
Tian Feng, Beijing, CN;
Yuhao Tong, Beijing, CN;
Haihai Xie, Beijing, CN;
Zhicheng Fan, Beijing, CN;
Chongqing BOE Electronic Technology Co., Ltd., Chongqing, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
In the printed circuit board, normal pads that are not peeled off or damaged are first pads, Each first pad and a wire connected to the first pad have an integrated structure and are directly formed on a substrate. After a pad at a position on the substrate is peeled off, a second pad can be provided at the position, so as to replace the pad that was peeled off. The second pad comes into contact with the wire and is fixed to the wire by solder. The first pin of a component is lapped with the first pad and is fixed with the first pad by solder. The second pin of the component is lapped with the second pad and is fixed with the second pad by solder.