The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Jun. 24, 2024
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyosang An, Suwon-si, KR;
Hwajoong Jung, Suwon-si, KR;
Beomsik Kim, Suwon-si, KR;
Bongchan Kim, Suwon-si, KR;
Taehwan Kim, Suwon-si, KR;
Hyungjin Rho, Suwon-si, KR;
Jaeheung Park, Suwon-si, KR;
Kwangseok Byon, Suwon-si, KR;
Jonghoon Won, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A camera module according to various embodiments of the disclosure may include: an image sensor (); a substrate () electrically connected to the image sensor (); a bracket () configured to fix the substrate (); and a plate () disposed on the bracket () such that the width () of a surface of the plate () facing the image sensor () includes the width () of an area in which the image sensor () is disposed, thereby shielding at least a part of a space in which the image sensor () is disposed from the outside, wherein the bracket () may be formed by injection molding a material forming the bracket () in a state in which the plate () is inserted into a mold. Various other embodiments inferable from the specification are also possible.