The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Mar. 15, 2021
Applicant:

Aptiv Manufacturing Management Services Gmbh, Schaffhausen, CH;

Inventors:

Sean Krompegel, Canfield, OH (US);

David A. Myers, Hubbard, OH (US);

Jeffrey M. Handel, Canfield, OH (US);

Keith B. Adkins, Warren, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/055 (2006.01); H01R 43/048 (2006.01); H01R 43/05 (2006.01); H01R 43/052 (2006.01); H01R 43/20 (2006.01);
U.S. Cl.
CPC ...
H01R 43/055 (2013.01); H01R 43/0486 (2013.01); H01R 43/05 (2013.01); H01R 43/052 (2013.01); H01R 43/20 (2013.01); Y10T 29/53235 (2015.01);
Abstract

An automated wire kitting system for assembling wire leads for a wired connector comprises a terminal delivery system configured to obtain a target terminal from a plurality of different types of terminals for wire leads and a crimp press comprising a plurality of dies and being configured to obtain a wire having an exposed portion where the wire's insulation has been removed, receive the target terminal from the terminal delivery system, engage a target die of the plurality of dies corresponding to a type of the target terminal, and crimp the target terminal onto the exposed portion of the wire using the target die of the plurality of dies to assemble a wire lead.


Find Patent Forward Citations

Loading…