The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Apr. 28, 2023
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Yiqi Tang, Allen, TX (US);

Rajen Murugan, Dallas, TX (US);

Harshpreet Singh Phull Bakshi, Dallas, TX (US);

Sylvester Ankamah-Kusi, Dallas, TX (US);

Juan Herbsommer, Allen, TX (US);

Aditya Nitin Jogalekar, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 21/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/005 (2013.01); H01Q 1/2283 (2013.01);
Abstract

An example microelectronic device package includes: a multilayer package substrate including a slotted waveguide antenna and having routing conductors, the multilayer package substrate having a device side surface and an opposing board side surface; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to slotted waveguide antenna by the routing conductors; and mold compound covering the semiconductor die, and a portion of the multilayer package substrate.


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