The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 26, 2023
Hirata Corporation, Kumamoto, JP;
Toru Miyazaki, Kumamoto, JP;
HIRATA CORPORATION, Kumamoto, JP;
Abstract
A wire bonding apparatus includes a conveying unit configured to convey a pallet on which a work is placed, at least one bonding head configured to perform wire bonding for the work, and a moving unit configured to move the at least one bonding head. The conveying unit includes a first conveying unit configured to convey the pallet to a work region, and a second conveying unit configured to convey the pallet in the work region. The second conveying unit includes a table with a positioning unit configured to positioning the pallet, a second moving mechanism configured to repeat moving the table and stopping the table. A positioning state of the pallet by the positioning unit is kept while the pallet is conveyed, and the at least one bonding head performs work for the work.