The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Sep. 08, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventor:

Vijay D. Parkhe, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23Q 3/00 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01);
Abstract

Methods for improving thermal uniformity on a surface of a substrate support assembly. One method includes temporarily clamping a ceramic puck plate to a cooling plate of a substrate support assembly with one or more layers of bonding material between the ceramic puck and the cooling plate. The method further includes heating the ceramic puck plate to a target temperature, cooling the cooling plate to an operating temperature, and recording temperatures at a plurality of locations on a substrate support surface of the ceramic puck plate. The method further includes modifying, based on the recorded temperatures, one or more properties of the one or more layers of the bonding material to achieve a target temperature profile on the substrate support surface.


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