The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Sep. 28, 2022
Applicant:

Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;

Inventors:

He Zhou, Shanghai, CN;

Yunyu Tang, Shanghai, CN;

Lei Shi, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/22 (2006.01); H01F 27/08 (2006.01); H01F 27/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 27/085 (2013.01); H01F 27/10 (2013.01);
Abstract

An inductor () is provided, and includes an inductor winding (), a housing (), and a thermally conductive packaging material (). The inductor winding is disposed in the housing. The thermally conductive packaging material is potted in the housing to fill a gap between the inductor winding and the housing. The thermally conductive packaging material includes a first packaging layer () and a second packaging layer (), and a coefficient of thermal conductivity of the first packaging layer is greater than a coefficient of thermal conductivity of the second packaging layer. The housing includes a heat dissipation wall () and a packaging wall (), and the first packaging layer is closer to the heat dissipation wall than the second packaging layer. Heat generated by the inductor can be dissipated after being transmitted to each surface of the housing through the thermally conductive packaging material.


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