The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

May. 26, 2020
Applicants:

Lg Electronics Inc., Seoul, KR;

Industry-university Cooperation Foundation Hanyang University Erica Campus, Gyeonggi-do, KR;

Inventors:

Soongil Kim, Seoul, KR;

Hongcheol Lee, Seoul, KR;

Hongjung Kim, Seoul, KR;

Jongdeok Kim, Seoul, KR;

Jongryeol Kim, Seoul, KR;

Minyeol Kim, Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C22C 33/04 (2006.01); C22C 38/00 (2006.01); C22C 38/16 (2006.01); H01F 41/14 (2006.01);
U.S. Cl.
CPC ...
H01F 1/147 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01F 41/14 (2013.01); C22C 33/04 (2013.01); C22C 38/002 (2013.01); C22C 38/16 (2013.01); C22C 2202/02 (2013.01);
Abstract

The present invention provides a method for manufacturing a conductive film, comprising the steps of: applying, to a substrate, a conductive paste dispersed in an organic material and comprising metal particles and Fe—B—Cu—C alloy magnetic heating element particles; and selectively sintering the applied conductive paste by means of induction heating so as to form a conductive film, wherein the magnetic heating element particles are implemented with crystallized Fe—B—Cu—C alloy particles. Therefore, it is possible to selectively form a conductive adhesive layer by sintering through induction heating. In addition, it is possible to produce an adhesive capable of low-temperature bonding by forming a magnetic heating element having crystal grains with a large coercive force through heat treatment after formation of an alloy.


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