The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Feb. 14, 2023
Applicant:

Digwise Technology Corporation, Ltd, Hsinchu County, TW;

Inventors:

Shih-Hao Chen, Hsinchu County, TW;

Chen-Hsiang Kao, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/27 (2020.01); G06F 30/398 (2020.01); G06N 3/094 (2023.01); H10P 74/00 (2026.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/27 (2020.01); G06F 30/398 (2020.01); H10P 74/277 (2026.01); G06F 2119/18 (2020.01); G06N 3/094 (2023.01);
Abstract

A chip-assisted design device and a method for constructing a chip characteristic distribution model. The apparatus includes a database and a processor. The database has a first chip characteristic distribution image data generated based on a wafer fabrication process data of a current process, wherein the first chip characteristic distribution image data represents a gradient distribution of at least one chip characteristic in one of the wafers produced through current fabrication process. The processor is coupled to the database. A second chip characteristic image data generated based on the first chip characteristic image data is used as a reference data for predicting the future wafer fabrication process, and the reference data is provided to the current fabrication process to evaluate or correct the first chip characteristic image.


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