The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Nov. 26, 2024
Applicant:

Halliburton Energy Services, Inc., Houston, TX (US);

Inventors:

Philip D. Nguyen, Houston, TX (US);

Ronald Glen Dusterhoft, Duncan, OK (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
E21B 43/267 (2006.01); E21B 43/24 (2006.01);
U.S. Cl.
CPC ...
E21B 43/267 (2013.01); E21B 43/2405 (2013.01); E21B 43/2408 (2013.01);
Abstract

A method of forming propped fractures in a subterranean formation penetrated by a wellbore is provided. The method includes injecting a fracturing fluid through a (e.g., geothermal, SAGD) wellbore into the subterranean formation, thus creating fractures in the subterranean formation, whereby the aggregates and dissolvable particulates are positioned in the created fractures. The fracturing fluid comprises a carrier fluid; aggregates; and dissolvable particulates (e.g., proppant, sand; that dissolves over time under downhole conditions, e.g., T≥230° C.). The method further includes allowing the aggregates to cure into hardened masses (e.g., for functioning as pillars); and dissolving the dissolvable particulates, whereby voids and/or (e.g., solids-free) channels are formed in the (e.g., highly conductive) propped fractures, wherein the voids and/or channels (e.g., surround the solid masses and) provide pathways (e.g., for fluid to flow) through the (e.g., highly conductive) propped fractures (e.g., from the wellbore to another wellbore).


Find Patent Forward Citations

Loading…