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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12692604 B1

PDFFull Text
Date of Patent:
Jul. 28, 2026

Filed:

Feb. 06, 2023

Preparing method of two-dimensional materials with controlled number of layers

Applicant:

Ajou University Industry-academic Cooperation Foundation, Suwon-si, KR;

Inventors:

Jaehyun Lee, Bucheon-si, KR;

Jiyun Moon, Yongin-si, KR;

Assignee:

AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Joseph A Miller, Jr

Int. Cl.
CPC ...
C23C 16/50 (2006.01); C23C 14/06 (2006.01); C23C 14/58 (2006.01); C23C 16/52 (2006.01); C23C 16/56 (2006.01); C23C 14/24 (2006.01); C23C 14/34 (2006.01);
U.S. Cl.
CPC ...
C23C 16/50 (2013.01); C23C 14/0623 (2013.01); C23C 14/0635 (2013.01); C23C 14/5806 (2013.01); C23C 16/52 (2013.01); C23C 16/56 (2013.01); C23C 14/24 (2013.01); C23C 14/3464 (2013.01);
Abstract

The present disclosure relates to a preparing method of two-dimensional materials with a controlled number of layer including depositing a metal thin film on a surface of a bulk material; exfoliating a two-dimensional material from the surface of the bulk material together with the metal thin film; and transferring the two-dimensional material onto a substrate, in which the number of layers of the two-dimensional material to be exploited is controlled by controlling an internal stress of the metal thin film.

Find Patent Forward Citations

Lee, Jaehyun. (2026). Preparing method of two-dimensional materials with controlled number of layers (U.S. Patent No. 12692604). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12692604

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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