The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Sep. 20, 2022
Applicant:
Nippon Steel Corporation, Tokyo, JP;
Inventors:
Shingo Fujinaka, Tokyo, JP;
Hitomi Nishibata, Tokyo, JP;
Assignee:
NIPPON STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/60 (2006.01); C21D 1/18 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C21D 8/0221 (2026.01); C21D 8/0247 (2026.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/20 (2006.01); C22C 38/22 (2006.01); C22C 38/24 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C22C 38/30 (2006.01); C22C 38/32 (2006.01); C22C 38/38 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/54 (2006.01);
U.S. Cl.
CPC ...
C22C 38/60 (2013.01); C21D 1/18 (2013.01); C21D 6/002 (2013.01); C21D 6/004 (2013.01); C21D 6/005 (2013.01); C21D 6/007 (2013.01); C21D 6/008 (2013.01); C21D 8/02 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0263 (2013.01); C21D 9/46 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/008 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/20 (2013.01); C22C 38/22 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/30 (2013.01); C22C 38/32 (2013.01); C22C 38/38 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C21D 2211/001 (2013.01); C21D 2211/008 (2013.01);
Abstract
A hot-stamp formed body has a predetermined chemical composition and has a microstructure including, by area ratio, martensite: 90% to 100% and a remainder in the microstructure: 0% to 10%. The percentage of martensite having a GAIQ value of 40000 or less in all of the martensite is less than 5.0%, an average grain size of prior austenite grains is 6.0 μm or less, and a standard deviation of grain sizes of the prior austenite grains is 2.6 μm or less.
Fujinaka, Shingo. (2026). Hot-stamp formed body (U.S. Patent No. 12692585). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12692585
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile