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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12692424 B1

PDFFull Text
Date of Patent:
Jul. 28, 2026

Filed:

Mar. 18, 2020

Curable silicone composition, cured product of same, and method for producing same

Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:

Warner Norcross + Judd LLP

Primary Examiner:

Kevin R Kruer

Int. Cl.
CPC ...
C09J 183/04 (2006.01); B29C 43/00 (2006.01); B29C 43/24 (2006.01); B29C 43/28 (2006.01); B29C 43/30 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); C08L 83/04 (2006.01); C09J 5/06 (2006.01); C09J 7/35 (2018.01); C09J 11/04 (2006.01); B29K 83/00 (2006.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01); H10W 74/47 (2026.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); B29C 43/003 (2013.01); B29C 43/24 (2013.01); B29C 43/28 (2013.01); B29C 43/305 (2013.01); B29C 45/0001 (2013.01); B29C 45/14 (2013.01); C08L 83/04 (2013.01); C09J 5/06 (2013.01); C09J 7/35 (2018.01); C09J 11/04 (2013.01); B29K 2083/00 (2013.01); B29L 2007/002 (2013.01); B29L 2031/34 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01); C09J 2203/326 (2013.01); C09J 2400/16 (2013.01); C09J 2483/00 (2013.01); H10W 74/476 (2026.01);
Abstract

Provided is a curable silicone composition and uses thereof. The composition has hot-melt properties, strongly adheres to difficult-to-adhere to base materials, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with a lead frame or the like. The composition comprises: (A1) an organopolysiloxane resin having no hot-melt properties as a whole molecule and contains 20 mol % or more of a siloxane unit represented by SiO, (A2) a liquid chain organopolysiloxane having at least two curing-reactive functional groups in the molecule, (B) a silatrane derivative or carbasilatrane derivative, (C) a curing agent, and (D) a functional inorganic filler. The content of component (D) is at least 10% by volume. The composition has hot-melt properties at a temperature of 200° C. or lower.

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