The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Nov. 01, 2022
Heraeus Electronics Gmbh & Co. KG, Hanau, DE;
Andre Schwöbel, Hanau, DE;
Daniel Schnee, Hanau, DE;
Leszek Niewolak, Hanau, DE;
Miriam Rauer, Hanau, DE;
Ruzica Denadic, Hanau, DE;
Heraeus Electronics GmbH & Co. KG, Hanau, DE;
Abstract
A metal-ceramic substrate which has a highly stable bond between the metal layer and the ceramic body, and also high thermal conductivity and electrical conductivity. The metal-ceramic substrate comprises (a) a ceramic body, (b) a metal layer, and (c) a bonding layer located between the ceramic body and the metal layer. The bonding layer comprises (i) a metal M1 having a melting point of at least 700° C., (ii) a metal M2 having a melting point of less than 700° C., (iii) a metal M3 selected from the group of active metals, and (iv) a metal M4 selected from the group consisting of bismuth, gallium, zinc, indium, germanium, aluminum and magnesium. The bonding layer has the following characteristics: (c1) M(M2)=10-20 weight percent, (c2) 15 weight percent≤[M(M4)/M(M2)]*1000 weight percent+M(M2)≤100 weight percent and (c3) M(Ag)<10 weight percent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile