The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2026

Filed:

Nov. 07, 2023
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Hoang T. Nguyen, Livermore, CA (US);

Candis Alexzandra Jackson, Tracy, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
C03C 15/00 (2013.01);
Abstract

A method of fabricating metamaterial structures without exceeding 30° C. or less in temperature comprises forming a metasurface mask by depositing a layer of nanoparticles on a surface of the substrate, etching the surface of the substrate with the nanoparticles thereon using reactive ion beam etching (RIBE), and removing at least a portion of the nanoparticles from the etched surface. Nanometer size surface features are thereby formed on the surface of a material without exceeding 30° C. in temperature, thereby forming metamaterial structures with a reduced incidence of thermal damage to the material.


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Nguyen, Hoang. (2026). Low-temperature fabrication method of bulk metamaterial structures for heat-sensitive materials (U.S. Patent No. 12692189). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12692189

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