The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
Mar. 10, 2021
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Toshiki Kitazawa, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A composite material molding method for molding a composite material by integrating a first fiber base material which is formed in a plate shape and a second fiber base material. The method includes installing, in a recess in a first molding surface of a molding tool, the second fiber base material formed in a shape corresponding to the recess; fixing a first fiber-reinforced portion which is a part of a plurality of fiber reinforced sheets included in the first fiber base material to the first molding surface to cover the recess in which the second fiber base material is installed by the installation step; laying up a second fiber-reinforced portion on the first fiber-reinforced portion fixed by the fixing step; and molding the composite material by integrating and curing the first fiber base material and the second fiber base material installed in the recess using a resin material.